Title :
Technology scaling and reliability: Challenges and opportunities
Author :
V. Huard;F. Cacho;X. Federspiel;W. Arfaoui;M. Saliva;D. Angot
Author_Institution :
STMicroelectronics 850 rue jean monnet 38926 Crolles, France
Abstract :
This paper reviews the challenges in reliability degradation and modeling triggered by the unwavering technology scaling. By an adequate modeling and choice of tools, the challenges can be turn out to opportunities to enhance IPs and products performances through an accurate trade-off with reliability.
Keywords :
"Reliability","Degradation","Mathematical model","Human computer interaction","Solid modeling","SPICE","Aging"
Conference_Titel :
Electron Devices Meeting (IEDM), 2015 IEEE International
Electronic_ISBN :
2156-017X
DOI :
10.1109/IEDM.2015.7409743
