Title :
High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology
Author :
Chung-Hao Tsai;Jeng-Shien Hsieh;Wei-Heng Lin;Liang-Ju Yen;Jeng-Nan Hung;Tai-Hao Peng;Hsi-Ching Wang;Cheng-Yu Kuo;Issac Huang;Welling Chu;Yi-Yang Lei;C. H. Yu;Lawrence C. Sheu;Ching-Hua Hsieh;C. S. Liu;Kuo-Chung Yee;Chuei-Tang Wang;Doug Yu
Author_Institution :
R&D, TSMC, Ltd. 168, Park Ave. 2, Hsinchu Science Park, Hsinchu County, Taiwan 308-44, R.O.C.
Abstract :
High performance passive devices for millimeter wave (MMW) system, including inductor, ring resonator, power combiner, coupler, balun, transmission line, and antenna, are first realized using integrated fan-out (InFO) wafer level packaging technology. The inductors has quality factor over 40; the power combiner, coupler, and balun show lower transmission loss than on-chip passives; antenna has the efficiency of over 60%. These devices on InFO enable low noise and power MMW system for mobile communication and IoT applications.
Keywords :
"Loss measurement","Transmission line measurements","Propagation losses","Inductors","Couplers","Impedance matching","Power combiners"
Conference_Titel :
Electron Devices Meeting (IEDM), 2015 IEEE International
Electronic_ISBN :
2156-017X
DOI :
10.1109/IEDM.2015.7409763
