Title :
An integrated silicon photonics technology for O-band datacom
Author :
N. B. Feilchenfeld;F. G. Anderson;T. Barwicz;S. Chilstedt;Y. Ding;J. Ellis-Monaghan;D. M. Gill;C. Hedges;J. Hofrichter;F. Horst;M. Khater;E. Kiewra;R. Leidy;Y. Martin;K. McLean;M. Nicewicz;J. S. Orcutt;B. Porth;J. Proesel;C. Reinholm;J. C. Rosenberg;W. D.
Author_Institution :
IBM Systems & Technology Group, Microelectronics Division, 1000 River St., Essex Junction, Vermont 05452, USA
Abstract :
A manufacturable platform of CMOS, RF and opto-electronic devices fully PDK enabled to demonstrate a 4×25 Gb/s reference design is presented. With self-aligned fiber attach, this technology enables low-cost O-band data-com transceivers. In addition, this technology can offer enhanced performance and yield in hybrid-assembly for applications at 25 Gbaud and beyond.
Keywords :
"CMOS integrated circuits","Photonics","Optical transmitters","Adaptive optics","Optical fiber couplers","Optical variables measurement"
Conference_Titel :
Electron Devices Meeting (IEDM), 2015 IEEE International
Electronic_ISBN :
2156-017X
DOI :
10.1109/IEDM.2015.7409768
