Eliminating proximity effects and improving transmission in field emission vacuum microelectronic devices for integrated circuits

This work evaluates crosstalk and transmission efficiency in multi-integrated field emission vacuum microelectronic devices (FE-VMDs). Experimental evidence showed that proximity effects cannot be neglected, therefore indicating a need for additional control to take full advantage of the potential microfabricated packing density. Simulations were used to understand the root cause, design structural solutions, and improve overall device performance. Furthermore, charged particle transmission was experimentally investigated for initial structures and new design features are proposed for improved performance.