Frequency dependence in high speed interconnections

Author

Kergonou, G. ; Drissi, M. ; Zak, T. ; Xavier, Cleon

Author_Institution

LCST/INSA, CNRS, Rennes, France

Volume

1

fYear

2001

fDate

2001

Firstpage

632

Abstract

This paper describes an evaluation of the used transmission line model for high-speed interconnections. The scattering parameters for some microstrip interconnections and their associated discontinuities (straight line, 90° bend and double 45° bend) are compared both to the electrical and electromagnetic simulation and to the measurements. S-parameters permit an approach to the structure total losses and various simulations highlighting radiation, dielectric and metallic losses. The radiation analysis is also performed, thanks to the method of moments, and the obtained results are reported and discussed

Keywords

S-parameters; electromagnetic fields; interconnections; losses; method of moments; microstrip couplers; microstrip discontinuities; printed circuits; transmission line theory; PCB; S-parameters; dielectric losses; electrical simulation; electromagnetic simulation; frequency dependence; high-speed interconnections; metallic losses; method of moments; microstrip discontinuities; microstrip interconnections; planar interconnections; radiation analysis; radiation losses; scattering parameters; structure total losses; transmission line model; Dielectric losses; Dielectric measurements; Electric variables measurement; Electromagnetic radiation; Electromagnetic scattering; Frequency dependence; Microstrip; Scattering parameters; Transmission line discontinuities; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on

Conference_Location

Montreal, Que.

Print_ISBN

0-7803-6569-0

Type

conf

DOI

10.1109/ISEMC.2001.950718

Filename

950718