DocumentCode
375842
Title
High resolution micromachining using short wavelength and short pulse lasers
Author
Cashmore, J. ; Gower, M. ; Gruenewald, P. ; Karnakis, D. ; Rizvi, N. ; Whitfield, M.
Author_Institution
Exitech Ltd., Oxford, UK
Volume
1
fYear
2001
fDate
15-19 July 2001
Abstract
High-resolution micromachining of a range of materials (polymers, fused silica, silicon, diamond) has been investigated using both short wavelength (157 nm, F/sub 2/) and short (100 fsec, Ti:Al/sub 2/O/sub 3/) pulse laser radiation. Results using the two sources are compared.
Keywords
laser beam machining; micromachining; 100 fs; 157 nm; Al/sub 2/O/sub 3/:Ti; C; F/sub 2/; F/sub 2/ laser; Si; SiO/sub 2/; Ti:Al/sub 2/O/sub 3/ pulse laser; diamond; fluoro-ethylene polymer; fused silica; high-resolution micromachining; polymers; short pulse laser radiation; short wavelength laser radiation; silicon; Conducting materials; Electromagnetic wave absorption; Etching; Micromachining; Optical materials; Optical pulses; Photonic band gap; Polymers; Pulsed laser deposition; Silicon compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 2001. CLEO/Pacific Rim 2001. The 4th Pacific Rim Conference on
Conference_Location
Chiba, Japan
Print_ISBN
0-7803-6738-3
Type
conf
DOI
10.1109/CLEOPR.2001.967840
Filename
967840
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