DocumentCode
375846
Title
157 nm-248 nm multiwavelength excitation processing for application in optoelectronic manufacturing
Author
Obata, K. ; Sugioka, K. ; Akane, T. ; Aoki, N. ; Toyoda, K. ; Midorikawa, K.
Author_Institution
RIKEN, Inst. of Phys. & Chem. Res., Saitama, Japan
Volume
1
fYear
2001
fDate
15-19 July 2001
Abstract
Simultaneous irradiation of F/sub 2/ and KrF excimer lasers was demonstrated for high-quality ablation and photo-sensitivity of fused silica. Micropatterns were formed on fused silica by both the etching and the refractive index modification with little surface damage.
Keywords
etching; excimer lasers; laser ablation; laser materials processing; micro-optics; optical fabrication; refractive index; silicon compounds; 157 to 248 nm; F/sub 2/; F/sub 2/ excimer lasers; KrF; KrF excimer lasers; SiO/sub 2/; etching; fused silica; high-quality ablation; micropatterns; multiwavelength excitation processing; optoelectronic manufacturing; photo-sensitivity; refractive index modification; simultaneous irradiation; surface damage; Chemical industry; Chemical technology; Gas lasers; Laser ablation; Laser beams; Laser excitation; Manufacturing processes; Mirrors; Silicon compounds; Toy manufacturing industry;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 2001. CLEO/Pacific Rim 2001. The 4th Pacific Rim Conference on
Conference_Location
Chiba, Japan
Print_ISBN
0-7803-6738-3
Type
conf
DOI
10.1109/CLEOPR.2001.967844
Filename
967844
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