Overview of high capacity optical cross-connects

Author

Bergman, Keren

Author_Institution

Tellium Inc, Oceanport, NJ, USA

Volume

1

fYear

2001

fDate

2001

Firstpage

224

Abstract

We consider a typical Z-configuration for a 3D optical cross-connect fabric. In this design the MEMS chips are inclined and located a sufficient distance from each other, so that any one of the input port mirrors can be pointed to any one of the output port mirrors. Applying a physical layer gaussian beam propagation method to model the optical path, we study the required tolerances in assembly and packaging of the optical components by computing the excess loss associated with relative beam deviations from the center optical path

Keywords

micro-optics; micromechanical devices; mirrors; optical interconnections; optical losses; optical switches; packaging; 3D optical cross-connect fabric; MEMS chips; Z-configuration; assembly; center optical path; cross-connect switch; excess loss; high capacity optical cross-connects; input port mirrors; optical components; optical path; output port mirrors; overview; packaging; physical layer gaussian beam propagation method; relative beam deviations; tolerances; Assembly; Fabrics; Micromechanical devices; Mirrors; Optical computing; Optical devices; Optical propagation; Packaging; Physical layer; Physics computing;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE

Conference_Location

San Diego, CA

ISSN

1092-8081

Print_ISBN

0-7803-7105-4

Type

conf

DOI

10.1109/LEOS.2001.969254

Filename

969254