Process variability in FinFET standard cells with different transistor sizing techniques

This work evaluates the impact of process variations on the electrical behavior of a set of combinational cells considering different transistor sizing techniques: minimum sizing, logical effort and delay-optimized sizing. The optimization is done by a transistor sizing tool that employs geometric programming. The main point is to observe how transistor sizing techniques could be explored for the FinFET standard cells design. Results show that cells sized accordingly logical effort technique are more sensible to process variability when compared with minimum transistor sizing. The best process variability robustness is achieved by adopting the delay-optimized sizing technique.