Void free embedment of high voltage electronic modules

This paper discusses general embedment techniques applicable to miniaturized, high voltage power supply systems for space applications, such as shown in Figure 1. The need for minimum size, weight, and reliable performance of several years in deep space environment is a severe requirement for the insulation of these systems. It is known that voids (bubbles) in the insulation of high voltage systems can result in sudden partial breakdown of the insulation. Such insulation breakdown, generally referred to as Corona Discharge or Partial Discharge, results from high electric field stress in the insulation.