Title :
Arc plasma sprayed metallization on microwave ceramic substrates
Author_Institution :
APS-Materials, Inc., Dayton, Ohio, USA
Abstract :
The electrical performance of these films is quite satisfactory for all applications of metallizations. The adherence of these films matches or exceeds the intrinsic strengths of the commercial substrates presently available. It is likely that both metallizations can pass the −30 to +85°C mil specs. Both will respond well to hermetic encapsulation in helium.
Keywords :
"Substrates","Microwave circuits","Microwave integrated circuits","Films","Plasmas","Ferrites"
Conference_Titel :
Electrical/Electronics Insulation Conference, 1975 EIC 12th
Print_ISBN :
978-1-5090-3111-5
DOI :
10.1109/EIC.1975.7458504
