DocumentCode :
3773258
Title :
Miniature explosive bonding for electrical interconnections
Author :
B. H. Cranston
Author_Institution :
Western Electric, Engineering Research Center, Princeton, New Jersey
fYear :
1973
Firstpage :
202
Lastpage :
204
Abstract :
Although explosive energy has been used for a number of years to produce large scale, solid phase bonds, its small scale use entails unique problems. Current studies have dealt with these problems, producing a safe, reliable bonding method scaled to the needs of the electronics industry.
Keywords :
"Explosives","Bonding","Solids","Reliability","Copper","Nickel"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN :
978-1-5090-3110-8
Type :
conf
DOI :
10.1109/EIC.1973.7468685
Filename :
7468685
Link To Document :
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