Kerimid 601 polyimide resin for multilayer printed wiring boards

Since the discovery of condensation polyimide resins in the early 1960´s, engineers in all fields of endeavor have sought to prepare composite parts where maximum use could be made of their exciting properties. Typical attributes include: high heat resistance (500°F and up), good mechanical properties, outstanding dimensional stability, excellent electricals, chemical inertness, low out-gassing, radiation and cryogenic temperature stability, and inherent nonflammability. These attempts were frequently thwarted, however, by discouraging resin processability. Indeed, extensive and complex cure and post-bake cycles are required and strict adherence to fabrication parameters is demanded. Several years of further research have resulted in commercialization of a new class of polyimide resins-addition types.