• DocumentCode
    3774586
  • Title

    Roadmap for design and EDA infrastructure for 3D products

  • Author

    Riko Radojcic

  • Author_Institution
    Qualcomm, United States
  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    21
  • Abstract
    This article consists of a collection of slides from the author´s conference presentation on the design and electronic design automation (EDA) infrastructure for three-dimensional mobile display products. Some of the specific topics discussed include: EDA design methodologies; options for chip design; memory capacity; evolving 3D technologies; ecosystems for 3D designs; thermal challenges; inventories of core design technologies; design environments for interposers; and the design environment for logic on logic design.
  • Keywords
    "Three-dimensional displays","Stacking","Random access memory","Electronic design automation","Product development","Memory management","Manufacturing processes"
  • Publisher
    ieee
  • Conference_Titel
    Hot Chips 24 Symposium (HCS), 2012 IEEE
  • Type

    conf

  • DOI
    10.1109/HOTCHIPS.2012.7476473
  • Filename
    7476473