DocumentCode
3774587
Title
Xilinx SSI technology concept to silicon development overview
Author
Shankar Lakka
fYear
2012
Firstpage
1
Lastpage
22
Abstract
This article consists of a collection of slides from the author´s conference presentation. Presents the product design and applications supported by Xilinx stacked silicon interconnect (SSI) technology. Identifies the economics drivers and technical challenges the company faces to develop its SSI products/services. Discusses the progression and development of three-dimensional (3D) technolgies. Also examines capacity planning; FPGA technologies for SSI development; and future market opportunties.
Keywords
"Silicon","Mobile communication","Three-dimensional displays","Stacking","Programmable logic","Market opportunities","Economics"
Publisher
ieee
Conference_Titel
Hot Chips 24 Symposium (HCS), 2012 IEEE
Type
conf
DOI
10.1109/HOTCHIPS.2012.7476474
Filename
7476474
Link To Document