• DocumentCode
    3775173
  • Title

    Intel® QuickPath interconnect overview

  • Author

    Robert Safranek

  • Author_Institution
    Intel, USA
  • fYear
    2009
  • Firstpage
    1
  • Lastpage
    27
  • Abstract
    Presents a collection of slides covering the following topics: Intel QuickPath Interconnect; platform configuration; physical layer; link pair; transmitter discrete-time linear equalizer; coefficient search; link layer; virtual channel mapping function; message class; command insert interleave; routing layer; protocol layer; and configuration agent.
  • Keywords
    "Topology","Protocols","Routing","Intellectual property","Warranties","Program processors","Current measurement"
  • Publisher
    ieee
  • Conference_Titel
    Hot Chips 21 Symposium (HCS), 2009 IEEE
  • Type

    conf

  • DOI
    10.1109/HOTCHIPS.2009.7478336
  • Filename
    7478336
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3775173