Reaserch on Au/Sn solder of microstrip in aluminium cavity

Eutectic is an important technology of microelectronics assembly. It has a vital effect in microwave circuit. In this article, the briefly principle of eutectic is discussed firstly, then the factors that the Au thickness of the substrate metallization, the pressure on the substrate and sintering process curve analysis were studied in the eutectic progress. The experiment shows that when the Au thickness of the substrate metallization is about 3μm, a high quality of welding can be achieved in 340°C using 60s by vacuum eutectic curve. The results shows that welding on the Al substrate has a low welding void raio, the penetration rate is up to 95% and the shear strength of samples can meet the requirement of GJB548B-2005. Finally, the welding mechanization was invested in this article.