• DocumentCode
    378585
  • Title

    High temperature stable high electromechanical coupling substrates and application for surface acoustic wave devices

  • Author

    Yamanouchi, Kazuhiko ; ISHII, Toru

  • Author_Institution
    Tohoku Inst. of Technol., Sendai, Japan
  • Volume
    1
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    189
  • Abstract
    In this paper, in order to improve the TCF the propagation characteristics of SiO2/Rotated Y-cut, X-propagating LiNbO 3 leaky SAW substrates with a large electromechanical coupling coefficient (k2) and zero temperature coefficient of frequency (TCF) are theoretically investigated. The results showed a large k2 of leaky SAW over 0.2 (zero k2 of Rayleigh mode), zero TCF and zero propagation attenuation in the case of short boundary at thin film thickness of H/λ≑0.15-0.25(H: SiO2 film thickness, λ:SAW wavelength) were obtained. The experimental results agreed to the theoretical ones
  • Keywords
    lithium compounds; piezoelectric materials; silicon compounds; substrates; surface acoustic wave devices; LiNbO3 substrate; Rayleigh mode; SiO2 thin film; SiO2-LiNbO3; electromechanical coupling coefficient; leaky SAW mode; propagation attenuation; surface acoustic wave device; temperature coefficient of frequency; temperature stability; Acoustic propagation; Acoustic waves; Attenuation; Frequency; Laplace equations; Substrates; Surface acoustic wave devices; Surface acoustic waves; Surface waves; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2001 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-7177-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2001.991606
  • Filename
    991606