• DocumentCode
    37860
  • Title

    Fatigue Degradation Properties of LIGA Ni Films Using Kilohertz Microresonators

  • Author

    Baumert, E.K. ; Pierron, O.N.

  • Author_Institution
    George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    22
  • Issue
    1
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    16
  • Lastpage
    25
  • Abstract
    A micrometer-scale ultrasonic fatigue characterization technique is introduced to investigate the fatigue degradation properties of LIGA Ni structural films in the very high cycle fatigue regime. Kilohertz microresonators fabricated with the MetalMUMPs process were driven at resonance (~ 8 kHz) in controlled environments (30 °C , 50% relative humidity (RH); 80 °C, 5% RH; and 80 °C, 90% RH) to perform fatigue tests on 20-μm -thick Ni notched beams subjected to fully reversed bending over a wide range of stress amplitudes. It is shown that the fatigue degradation occurring at the notch, observed with scanning electron microscopy, can be quantified with the measured evolution of the microresonators´ resonant frequency. The fatigue damage consists of extrusion formation and microcrack nucleation and does not propagate to form fatal cracks due to the extreme stress gradients at the notch. The resonant frequency evolution for fatigue tests performed at 80 °C, 90% RH suggests that stress-assisted oxidation in the presence of humid environments may accentuate fatigue damage formation. This experimental technique brings critical information regarding the long-term fatigue degradation properties of metallic microelectromechanical systems (MEMS) devices. In particular, this technique can allow controlled studies of the effects of fatigue localization and large stress gradients typically encountered in MEMS components.
  • Keywords
    LIGA; fatigue cracks; fatigue testing; microfabrication; micromechanical resonators; nickel; scanning electron microscopy; ultrasonic transducers; LIGA structural films; MEMS components; MetalMUMPs process; Ni; accentuate fatigue damage formation; extrusion formation; fatal cracks; fatigue degradation properties; humid environments; kilohertz microresonators; long-term fatigue degradation properties; metallic MEMS devices; metallic microelectromechanical systems devices; microcrack nucleation; micrometer-scale ultrasonic fatigue characterization technique; scanning electron microscopy; size 20 mum; stress gradients; stress-assisted oxidation; temperature 30 degC; temperature 80 degC; Fatigue; Microcavities; Micromechanical devices; Nickel; Resonant frequency; Strain; Stress; Fatigue; Ni; films; resonators;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2012.2212422
  • Filename
    6293834