3786986

Corrections to “Numerical Prediction of Electronic Component Operational Temperature: A Perspective”

27

4

2004

736

736

"Electronic components","Temperature measurement","Measurement uncertainty","Power dissipation","Temperature distribution","Insulation","Power measurement","Temperature dependence","Accuracy","Fluid flow measurement"

IEEE Transactions on Components and Packaging Technologies

ieee

1521-3331

jour

10.1109/TCAPT.2004.836775

1362810