Recycling of wastewater generated from semiconductor processing factories

Author

Nishimura, Masashi ; Kiyohara, Masao ; Sugiyama, Kohichi

Author_Institution

Ricoh Co. Ltd., Japan

fYear

2001

fDate

2001

Firstpage

578

Lastpage

582

Abstract

Recycling of HF wastewater from wafer process is essential to be a zero emission semiconductor factory. Silicon dioxide etchant is one of the most consumed HF chemical used during wafer process. It is often used as a cleaning solvent for cleaning of equipment parts. This article provides information on a new wastewater treatment system installed at Ricoh Electronic Devices Company´s Yashiro factory. For the first time in the world, HF raw material is being recycled. Also presented will be wastewater treatment cost and performance data

Keywords

etching; hydrogen compounds; integrated circuit manufacture; recycling; water treatment; HF; Ricoh Electronic Devices Company; SiO₂; Yashiro factory; cleaning solvent; recycling; semiconductor processing factories; silicon dioxide etchant; wafer process; wastewater; zero emission semiconductor factory; Chemical processes; Cleaning; Etching; Hafnium; Production facilities; Raw materials; Recycling; Silicon compounds; Solvents; Wastewater treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on

Conference_Location

Tokyo

Print_ISBN

0-7695-1266-6

Type

conf

DOI

10.1109/.2001.992427

Filename

992427