• DocumentCode
    3787630
  • Title

    Foreword Contributions From Thermal Investigations of ICs and Systems (THERMINIC)

  • Author

    C.J.M. Lasance;M. Rencz

  • Volume
    28
  • Issue
    1
  • fYear
    2005
  • Firstpage
    3
  • Lastpage
    4
  • Keywords
    "Thermal resistance","Testing","Components, packaging, and manufacturing technology","Packaging","Cooling","Thermal management","Equations","Fingers","Heterojunction bipolar transistors","Electrical resistance measurement"
  • Journal_Title
    IEEE Transactions on Components and Packaging Technologies
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.843178
  • Filename
    1402605
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3787630