• DocumentCode
    378776
  • Title

    Ambient intelligence, the next paradigm for consumer electronics: how will it affect silicon?

  • Author

    Boekhorst, F.

  • Author_Institution
    Philips Res., Eindhoven, Netherlands
  • Volume
    1
  • fYear
    2002
  • fDate
    7-7 Feb. 2002
  • Firstpage
    28
  • Abstract
    Ambient Intelligence refers to an environment where the user experience is what matters. People want to have fun, feel free, enjoy life, feel secure, be in control and be productive. This experience is not linked to one particular device but is realized by a network of devices present in the environment that will provide us these experiences in an intelligent way. Ambient Intelligence is introduced as a new paradigm in consumer electronics. Some of the technologies required for Ambient Intelligence are covered, with a focus on IC consequences. Ongoing work in three fields is described: ubiquitous radio, intuitive user/system interfaces and three-dimensional visual displays. These three fields highlight the diverse nature of Ambient Intelligence technologies as well as the resulting requirements for ICs. Considerations with respect to an introduction timeline of Ambient Intelligence are given.
  • Keywords
    application specific integrated circuits; consumer electronics; elemental semiconductors; integrated circuit design; intelligent networks; low-power electronics; pattern matching; signal processing; silicon; three-dimensional television; user interfaces; 3D visual displays; IC design; Si; ambient intelligence; consumer electronics; easy-access audio; intuitive user/system interfaces; pattern matching; ubiquitous radio; Ambient intelligence; Computational intelligence; Consumer electronics; Control systems; Costs; Intelligent sensors; Intelligent systems; Silicon; TV; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2002. Digest of Technical Papers. ISSCC. 2002 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-7335-9
  • Type

    conf

  • DOI
    10.1109/ISSCC.2002.992922
  • Filename
    992922