DocumentCode :
3787977
Title :
Converter concepts to increase the integration level
Author :
J. Popovic;J.A. Ferreira
Author_Institution :
Electr. Power Process. Group, Delft Univ. of Technol., Netherlands
Volume :
20
Issue :
3
fYear :
2005
Firstpage :
558
Lastpage :
565
Abstract :
In the previous work, a way to improve packaging of power electronic converters by increasing integration level and using multifunctional construction parts is presented. The quantities intended to evaluate integration level and volumetric utilization in power converters are introduced. Based on these values, a number of methods to increase the integration level are presented. A design process in the form of a flow chart that implements these methods in concrete design problems is presented. In this paper, the design process is applied to a dc/dc 42/14-V converter for automotive applications. Utilizing commercially available technologies that lend themselves to mass production this design process results in three packaging concepts, namely lead frame converter, printed circuit board embedded converter, and heat conductor converter. These concepts are then compared to a benchmark converter implemented in the conventional, discrete packaging technology. It is shown that by smart use of parts in the converter construction, the high values of integration level and high power densities can be achieved.
Keywords :
"Process design","Electronics packaging","Power electronics","Flowcharts","Concrete","Design methodology","Automotive applications","Mass production","Printed circuits","Conductors"
Journal_Title :
IEEE Transactions on Power Electronics
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/TPEL.2005.846555
Filename :
1427813
Link To Document :
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