DocumentCode :
3788038
Title :
Foreword Special Issue of Components and Packaging Technologies With Contributions From ITherm 2004 Thermal Management Track
Author :
K. Ramakrishna;B.G. Sammakia;J.R. Culham;Y.K. Joshi
Volume :
28
Issue :
2
fYear :
2005
Firstpage :
179
Lastpage :
181
Keywords :
"Thermal management","Technology management","Heat sinks","Electronic packaging thermal management","Thermal management of electronics","Heat transfer","Phase change materials","Thermal resistance","Speech","Predictive models"
Journal_Title :
IEEE Transactions on Components and Packaging Technologies
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2005.848625
Filename :
1432926
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3788038
