Title :
Micro-scratch inspection system for semiconductor process by two-ways laser scattering method
Author :
Ishimaru, Ichiro ; Noguchi, M.
Author_Institution :
Dept. of Intelligent Mech. Syst. Eng., Kagawa Univ., Takamatsu
Abstract :
CMP (Chemical Mechanical Polishing) is a key technology in semiconductor processing. However, when a problem arises in the polishing conditions, scratches are caused and yield can deteriorate drastically. We study the characteristic figure of scratch the depth of which is extremely shallow compared with width. We propose a 2-way illumination comparative discrimination method. By experiment, we obtain a good discrimination ratio between scratch and particle on unpatterned dummy wafers.
Keywords :
chemical mechanical polishing; flaw detection; inspection; integrated circuit measurement; light scattering; measurement by laser beam; process monitoring; CMP; characteristic figure of scratch; chemical mechanical polishing; defect discrimination; discrimination ratio; micro-scratch inspection system; scratch particle discrimination; semiconductor process; two-way laser scattering method; unpatterned dummy wafers; yield deterioration; Chemical lasers; Chemical processes; Chemical technology; Inspection; Lighting; Particle scattering; Production engineering; Semiconductor films; Semiconductor lasers; Wiring;
Conference_Titel :
Intelligent Control and Automation, 2002. Proceedings of the 4th World Congress on
Print_ISBN :
0-7803-7268-9
DOI :
10.1109/WCICA.2002.1021466
