• DocumentCode
    383198
  • Title

    Environmental influences on microassembly

  • Author

    Zhou, Quan ; Corral, Carlos Del ; Esteban, Pedro J. ; Aurelian, Albut ; Koivo, Heikki N.

  • Author_Institution
    Autom. & Control Inst., Tampere Univ. of Technol., Finland
  • Volume
    2
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    1760
  • Abstract
    Environmental conditions, such as temperature and humidity can influence the adhesion forces and microtribological properties of microparts. To have a good understanding of microassembly, it is essential to study the influences of environmental conditions to microassembly process and system. This paper presents our research in environment controlled microassembly, including an environment controlled microassembly system and early results of the influences of environmental parameters on microassembly and pick-and-place operations. The environment controlled microassembly station can control the environmental conditions including temperature and humidity in a closed chamber where microassembly is carried out. The temperature can be controlled in the range of 10-40°C and relative humidity of 5-80% RH. Experimental results of the influences of environmental conditions on a piezoelectric bender and piezo-ultrasonic stage are reported, as well as errors of pick-and-place operation. The experimental results show that both temperature and humidity can influence the performance and errors.
  • Keywords
    adhesion; environmental factors; humidity; microassembling; temperature; tribology; 10 to 40 degC; adhesion forces; environmental conditions; humidity influence; microassembling; microtribology; piezo ultrasonic stage; piezoelectric bender; temperature influence; Adhesives; Air cleaners; Assembly; Automation; Control systems; Humidity control; Microassembly; Surface tension; Temperature control; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Robots and Systems, 2002. IEEE/RSJ International Conference on
  • Print_ISBN
    0-7803-7398-7
  • Type

    conf

  • DOI
    10.1109/IRDS.2002.1044010
  • Filename
    1044010