Title :
IC failure analysis: magic, mystery, and science
Author :
J.M. Soden;R.E. Anderson;C.L. Henderson
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
Advancing IC and packaging technologies motivate and direct the future of failure analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry´s critical need for new diagnosis and failure analysis paradigms.
Keywords :
"Failure analysis","Optical microscopy","Magnetic force microscopy","Atomic force microscopy","Optical interconnections","Photonic integrated circuits","Electron beams","Optical imaging","Packaging","Integrated circuit testing"
Journal_Title :
IEEE Design & Test of Computers
