DocumentCode
385977
Title
Investigation and Evaluation of Low Loss Interconnects on Soft Substrates Clad to Aluminum
Author
Nelson, T.M. ; Kline, M.D.
fYear
1985
fDate
4-6 June 1985
Firstpage
188
Lastpage
191
Abstract
The purpose of this study is to provide a comparative evaluation of the quality of RF grounds used with microstrip circuitry on aluminum clad soft substrates. The data obtained by the study is documented and analyzed in the report with appropriate conclusions and recommendations provided.
Keywords
Aluminum; Assembly; Conducting materials; Copper; Dielectric substrates; Integrated circuit interconnections; Microstrip; Pins; Radio frequency; Springs;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1985 IEEE MTT-S International
Conference_Location
St. Louis, MO, USA
ISSN
0149-645X
Type
conf
DOI
10.1109/MWSYM.1985.1131937
Filename
1131937
Link To Document