مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

3862333

Title :

Evolution of Interconnects and Packaging

fYear :

2005

fDate :

6/5/2016 12:00:00 AM

Firstpage :

Lastpage :

Keywords :

"Packaging","Integrated circuit interconnections","Routing","Signal processing","Physical layer","Printed circuits","Clocks","Drives","Process design","Signal design"

Publisher :

ieee

Conference_Titel :

High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on

Print_ISBN :

0-7803-9292-2

Type :

conf

DOI :

10.1109/HDP.2005.251428

Filename :

4017469

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3862333