DocumentCode :
3863213
Title :
New decapsulation methods for ICs with Cu and Ag wires
Author :
Michael Obein;Francois Berger;Patrick Poirier
Author_Institution :
Digit Concept - Caen (FR)
fYear :
2015
Firstpage :
1
Lastpage :
4
Abstract :
Introduction of Cu and more recently of Ag wires in integrated circuits made the decapsulation more challenging for failure analysts. We made an experiment with the existing techniques we study in the past years and a comparison with the results and the emerging techniques from the last researchs. This study shows that solution has been demonstrated but there is still a place for improvement if we want to have a robust process for all types of ICs.
Keywords :
"Wires","Etching","Plasma temperature","Failure analysis","Integrated circuits","Chemistry"
Publisher :
ieee
Conference_Titel :
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
Type :
conf
DOI :
10.1109/EPTC.2015.7412398
Filename :
7412398
Link To Document :
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