• DocumentCode
    38691
  • Title

    Effect of Side and Tip Gaps of a Piezoelectric Fan on Microelectronic Cooling

  • Author

    Sufian, Shaker Farid ; Abdullah, M.Z. ; Abdullah, M.K. ; Mohamed, Julie Juliewatty

  • Author_Institution
    Sch. of Mech. Eng., Univ. Sains Malaysia, Nibong Tebal, Malaysia
  • Volume
    3
  • Issue
    9
  • fYear
    2013
  • fDate
    Sept. 2013
  • Firstpage
    1545
  • Lastpage
    1553
  • Abstract
    A combination of experimental and numerical analyses is conducted to investigate the coupled effect of side gap (Gs) and tip gap (δ) on the performance of a piezoelectric fan in microelectronic cooling. Two parallel adjustable walls are set at the fan sides to facilitate the variation of Gs. The piezoelectric fan is oriented vertically to the heat source (chip). A 3-D simulation using FLUENT 6.3.2 is performed to assess the transient flow and the resulting heat transfer from the chip. The coupled effect of Gs and δ on the fan tip deflection is detected by a laser displacement sensor (KEYENCE LK-G152). Both Gs and δ had noticeable effects on the flow behavior and Re. The effect of δ is more significant on the heat-transfer coefficient than that of Gs. The flow profiles and the temperature contours are found to be consistent with each other, and the predictions are in good agreement with the experimental results. The piezoelectric fan enhances the heat-transfer coefficient 1.95 to 2.7 times, corresponding to the best and worst cases, respectively.
  • Keywords
    cooling; fans; integrated circuit packaging; piezoelectric devices; thermal analysis; 3D simulation; FLUENT 6.3.2; fan tip deflection; heat source; heat transfer coefficient; laser displacement sensor; microelectronic cooling; piezoelectric fan; side gap; tip gap; transient flow; Enter electronic cooling; fluent; heat-transfer coefficient; piezoelectric fan; side gap; tip gap;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2251759
  • Filename
    6509437