DocumentCode
389956
Title
Trends and drivers in isolated board-mounted DC/DC products for communications applications
Author
Sayani, Mahmoud P. ; Wanes, John
Author_Institution
Celestica Inc, Toronto, Ont., Canada
Volume
1
fYear
2003
fDate
9-13 Feb. 2003
Firstpage
37
Abstract
The last few years have seen an acceleration in product development in isolated, board-mount DC/DC products for communications applications. This paper explores the drivers in the end market, trends in packaging and parameters in BMP development and identifies the challenges in continuing these trends.
Keywords
DC-DC power convertors; telecommunication power supplies; thermal management (packaging); board mounted power; communications applications; end market drivers; isolated board-mounted DC/DC products; packaging; product development; thermal management; Acceleration; Bandwidth; Communication switching; Communications technology; DC-DC power converters; DSL; Optical fiber devices; Packaging; Power systems; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2003. APEC '03. Eighteenth Annual IEEE
Conference_Location
Miami Beach, FL, USA
Print_ISBN
0-7803-7768-0
Type
conf
DOI
10.1109/APEC.2003.1179173
Filename
1179173
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