DocumentCode
39136
Title
24.7% Record Efficiency HIT Solar Cell on Thin Silicon Wafer
Author
Taguchi, M. ; Yano, Ayumu ; Tohoda, Satoshi ; Matsuyama, Kimihide ; Nakamura, Yoshihiko ; Nishiwaki, Toshihiro ; Fujita, Kinya ; Maruyama, Eri
Author_Institution
Solar Bus. Unit, Sanyo Electr. Co., Ltd., Kobe, Japan
Volume
4
Issue
1
fYear
2014
fDate
Jan. 2014
Firstpage
96
Lastpage
99
Abstract
A new record conversion efficiency of 24.7% was attained at the research level by using a heterojunction with intrinsic thin-layer structure of practical size (101.8 cm2, total area) at a 98-μm thickness. This is a world height record for any crystalline silicon-based solar cell of practical size (100 cm2 and above). Since we announced our former record of 23.7%, we have continued to reduce recombination losses at the hetero interface between a-Si and c-Si along with cutting down resistive losses by improving the silver paste with lower resistivity and optimization of the thicknesses in a-Si layers. Using a new technology that enables the formation of a-Si layer of even higher quality on the c-Si substrate, while limiting damage to the surface of the substrate, the Voc has been improved from 0.745 to 0.750 V. We also succeeded in improving the fill factor from 0.809 to 0.832.
Keywords
amorphous semiconductors; electrical resistivity; elemental semiconductors; optimisation; semiconductor heterojunctions; silicon; solar cells; HIT solar cell; Si; a-Si layer formation; c-Si substrate; conversion efficiency; crystalline silicon-based solar cell; fill factor; heterointerface; heterojunction; intrinsic thin-layer structure; recombination losses; resistive losses; resistivity; silver paste; substrate surface; thickness optimization; thin silicon wafer; Electrodes; Heterojunctions; Photovoltaic cells; Photovoltaic systems; Silicon; Amorphous materials; heterojunction; photovoltaic (PV) cells; silicon; surface passivation;
fLanguage
English
Journal_Title
Photovoltaics, IEEE Journal of
Publisher
ieee
ISSN
2156-3381
Type
jour
DOI
10.1109/JPHOTOV.2013.2282737
Filename
6620960
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