• DocumentCode
    391506
  • Title

    A growth process of hot-zone generated by high-frequency current

  • Author

    Shingu, Hiroyasu ; Furuhashi, Hideo ; Sumi, Tetsuo ; Uchida, Yoshiyuki

  • Author_Institution
    Aichi Inst. of Technol., Toyota, Japan
  • Volume
    2
  • fYear
    2002
  • fDate
    5-8 Nov. 2002
  • Firstpage
    1354
  • Abstract
    A phenomenon which raises the temperature at the electrical connection and electrical contact point of electric wires is investigated. When a large electric current flows in the electric wire connections, the temperature of the section rises and subsequently causes an electric fire. The area of the high temperature is small, but it can become as high as 1000°C. We have named it the "hot-zone phenomenon" and observed the growth process. The electrical characteristics of the hot-zone generated by current were measured for copper wire supplied with high-frequency voltage and current waveform. The formation processes of cuprous oxide in the connection were also studied. A triangular wave was used for the experiment. The area of the hot-zone was changed by heating the connection point. It was observed that the high temperature area was limited. The growth of the hot-zone and formation of the cuprous oxide by hot-zone was controlled by heating or adding bias voltage.
  • Keywords
    contact resistance; copper; copper compounds; electric connectors; wires (electric); CuO; bias voltage; connection point heating; copper wire; cuprous oxide; electric current flow; electric fire; electric wire connections; electric wires; electrical contact point; formation processes; high temperature; high-frequency current; high-frequency current waveform; high-frequency voltage waveform; hot zone growth process; triangular wave; Character generation; Contacts; Copper; Current measurement; Electric variables; Electric variables measurement; Fires; Heating; Temperature; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IECON 02 [Industrial Electronics Society, IEEE 2002 28th Annual Conference of the]
  • Print_ISBN
    0-7803-7474-6
  • Type

    conf

  • DOI
    10.1109/IECON.2002.1185472
  • Filename
    1185472