• DocumentCode
    392424
  • Title

    Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys

  • Author

    Song, J.M. ; Lan, G.F. ; Lui, T.S. ; Chen, L.H.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2002
  • fDate
    4-6 Dec. 2002
  • Firstpage
    276
  • Lastpage
    281
  • Abstract
    Mechanical properties of a potential lead-free solder, Sn-9Zn-xAg (x=0.5∼3.5 wt%), are examined in this study, particularly the vibration fatigue behavior. Results show that striated deformation of Sn-rich dendrites contributes to a greater damping capacity and thus the specimens with higher Ag content possessed a higher vibration life when suffering vibration with a constant vibration force. With respect to vibration under a fixed initial deflection amplitude, all the specimens had a similar vibration fracture resistance under low strain amplitude conditions, while high Ag specimens had a higher vibration cycles to failure under high strain conditions. This was closely related to the striated deformation along the main crack.
  • Keywords
    damping; dendritic structure; eutectic alloys; fatigue cracks; fracture toughness; silver alloys; soldering; tin alloys; vibrations; zinc alloys; Sn-Zn-Ag; Sn-Zn-Ag eutectic alloy; crack growth; damping capacity; dendrite deformation; lead-free solder; mechanical properties; microstructural properties; striated deformation; vibration fracture resistance; Capacitive sensors; Damping; Environmentally friendly manufacturing techniques; Lead; Materials science and technology; Mechanical factors; Resonance; Testing; Tin alloys; Vibration measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
  • Print_ISBN
    0-7803-7682-X
  • Type

    conf

  • DOI
    10.1109/EMAP.2002.1188850
  • Filename
    1188850