Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging

Author

Tsui, Yat-Kit ; Lee, S. W Ricky ; Huang, Xingjia

Author_Institution

Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China

fYear

2002

fDate

4-6 Dec. 2002

Firstpage

478

Lastpage

481

Abstract

The present study is an experimental investigation on the solder ball reliability of plastic ball grid array (PBGA) packages. Efforts are made to identify the room temperature aging effect on the degradation of solder ball shear strength. The samples are standard PBGA packages with 63Sn-37Pb eutectic solder balls. The specimens are subject to various lengths of room temperature aging after the reflow. After the designated aging period, ball shear tests are conducted to evaluate the solder ball shear strength. The experimental results show that the solder ball shear strength may drop by 10% within three days of room temperature aging. The outcome of the present study leads to a general guideline for the scheduling of solder ball shear tests. As a result, meaningful comparisons of PBGA solder ball shear strength may be achieved.

Keywords

ageing; integrated circuit packaging; integrated circuit reliability; plastic packaging; shear strength; BGA; Sn-Pb; degradation; eutectic solder balls; plastic ball grid array packages; reliability; room temperature aging; scheduling; shear tests; solder ball shear strength; Aging; Degradation; Electronic packaging thermal management; Electronics packaging; Guidelines; Job shop scheduling; Laboratories; Soldering; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on

Print_ISBN

0-7803-7682-X

Type

conf

DOI

10.1109/EMAP.2002.1188886

Filename

1188886