• DocumentCode
    393336
  • Title

    Effect of RAM amount on the thermal behavior of CPU operating under a heavy computational load

  • Author

    Naghedolfeizi, M. ; Arora, S. ; Garcia, S. ; Yousif, N.

  • Author_Institution
    Fort Valley State Univ., GA, USA
  • fYear
    2003
  • fDate
    11-13 March 2003
  • Firstpage
    156
  • Lastpage
    159
  • Abstract
    The purpose of this research was to investigate the effects of different RAM amount and fan failure on bulk CPU temperature rises while operating under a heavy computational load. Two sets of experiments, each with varying amounts of RAM were carried out under CPU cooling fan-on and fan-off conditions. A personal computer with an Intel Pentium III CPU was used to conduct the experiments. The computational load was the multiplication of two dimensional matrices (3100 by 3100) containing double precision numbers. To monitor temperature rises, sensitive thermocouples were installed on the CPU heat-sink, the RAM module, and the hard disk. This paper demonstrates that CPU temperature increases as more RAM becomes available to perform the computation. The authors hypothesize that the increase in CPU temperature is correlated to full CPU utilization to carry out a heavy computational load.
  • Keywords
    cooling; disc drives; heat sinks; integrated circuit measurement; microprocessor chips; random-access storage; temperature measurement; thermocouples; CPU RAM amount effects; CPU cooling; CPU thermal behavior; CPU utilization; RAM module; bulk CPU temperature rise; fan failure; fan-off condition; fan-on condition; hard disk; heat-sink; heavy computational load; temperature measurement; thermocouples; Central Processing Unit; Cooling; Hard disks; Microcomputers; Personal communication networks; Random access memory; Read-write memory; Temperature measurement; Temperature sensors; Thermal loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-7793-1
  • Type

    conf

  • DOI
    10.1109/STHERM.2003.1194355
  • Filename
    1194355