Title :
The adhesion problem for a microstructure with dimples
Author :
Tezuka, Shin-ichirou
Author_Institution :
Yokogawa Electr. Corp., Nagano, Japan
Abstract :
In this paper, we discuss an adhesion problem of double clamped beams with some ´dimples´ on the surface. We also derive some formulas for designing the dimensions of the dimples and the length of beams. On beams, the adhesion is dominated by the dimension of the center dimple, and the maximum length of beams which do not adhere to their substrate decreases with the inverse cube of the dimple.
Keywords :
adhesion; micromechanical devices; semiconductor device models; surface topography; adhesion problem; center dimple dimension; dimple dimensions design; double clamped beams; maximum beam lengths; microstructure dimples; substrate adhesion; surface micromachined structures; Adhesives; Boundary conditions; Clocks; Fabrication; Microstructure; Wet etching;
Conference_Titel :
SICE 2002. Proceedings of the 41st SICE Annual Conference
Print_ISBN :
0-7803-7631-5
DOI :
10.1109/SICE.2002.1195428
