DocumentCode
394107
Title
Analysis of quantum yield in n-channel MOSFETs
Author
Spinelli, A.S. ; Ielmini, D. ; Lacaita, A.L. ; Sebastian, Aradoaei ; Ghidini, G.
Author_Institution
Dipt. di Sci. Chimiche, Fisiche e Matematiche, Universita degli Studi dell´´Insubria, Como, Italy
fYear
2003
fDate
30 March-4 April 2003
Firstpage
412
Lastpage
416
Abstract
New experimental data on the recombination component of the SILC and on the correlation between the excess impact ionization component and the steady-state and transient components of the SILC are provided. By employing triple well structures, charge-separation experiments are performed directly on nMOSFETs, experimentally showing the existence of a hole SILC in such devices. Experiments are carried out as a function of the annealing time and stress dose, confirming that the excess impact ionization current is not correlated to the SILC, but rather to its transient component. This confirms previous results, showing that the reduction in quantum yield after stress cannot be used to quantitatively assess the energy loss of the SILC electrons.
Keywords
MOSFET; annealing; impact ionisation; leakage currents; semiconductor device breakdown; semiconductor device reliability; transient analysis; tunnelling; SILC; SILC electron energy loss; annealing time; breakdown processes; charge-separation experiments; excess impact ionization component; hole SILC; n-channel MOSFETs; nMOSFETs; quantum yield; recombination component; steady-state component; stress dose; stress-induced leakage current; transient component; triple well structures; Annealing; Charge carrier processes; Current measurement; Electron traps; Energy loss; Impact ionization; MOSFETs; Research and development; Stress measurement; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN
0-7803-7649-8
Type
conf
DOI
10.1109/RELPHY.2003.1197783
Filename
1197783
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