• DocumentCode
    394110
  • Title

    Lifetime prediction and design of reliability tests for high-power devices in automotive applications

  • Author

    Ciappa, Mauro ; Carbognani, F. ; Cova, P. ; Fichtner, Wolf

  • Author_Institution
    Integrated Syst. Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
  • fYear
    2003
  • fDate
    30 March-4 April 2003
  • Firstpage
    523
  • Lastpage
    528
  • Abstract
    Different procedures are defined and compared to extract the statistical distribution of the thermal cycles experienced by power devices installed in hybrid vehicles operated according to arbitrary mission profiles. This enables both to design efficient accelerated tests tailored on realistic data and to provide the input for lifetime prediction models. Initially, the system lifetime is predicted under the assumption of linear accumulation of the damage produced by low cycling fatigue. In the second part, a novel prediction model based on some fundamental equations is introduced which takes into consideration the creep experienced by compliant materials when they are submitted to thermal cycles.
  • Keywords
    automotive electronics; creep; insulated gate bipolar transistors; life testing; multichip modules; power transistors; semiconductor device reliability; semiconductor device testing; thermal stress cracking; IGBT; accelerated tests; arbitrary mission profiles; automotive applications; complex multi-chip modules; compliant materials; creep; cycling fatigue; high-power devices; hybrid vehicles; lifetime prediction; lifetime prediction models; linear damage accumulation; reliability test design; thermal cycle statistical distribution; thermal cycles; thermomechanical model; Automotive applications; Data mining; Equations; Fatigue; Life estimation; Life testing; Power system modeling; Predictive models; Statistical distributions; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
  • Print_ISBN
    0-7803-7649-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2003.1197803
  • Filename
    1197803