DocumentCode
394111
Title
Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees
Author
Gan, Chee Lip ; Thompson, Carl V. ; Pey, Kin Leong ; Choi, Wee Kiong ; Chang, Choon Wai ; Guo, Qiang
Author_Institution
Singapore-MIT Alliance, Singapore, Singapore
fYear
2003
fDate
30 March-4 April 2003
Firstpage
594
Lastpage
595
Abstract
While the reliability of a dual-damascene via is independent of the number of segments connected to it, it is strongly dependent on the distribution of current among the segments. The most highly stressed segments are not always the least reliable. This behavior for Cu is different than for Al.
Keywords
copper; current distribution; electromigration; failure analysis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; Cu; Cu metallization; current distribution; dual-damascene via; electromigration; failure time distribution; multi-terminal Cu dual-damascene interconnect trees; reliability; stressed segments; Artificial intelligence; Copper; Current density; Current distribution; Drives; Electromigration; Integrated circuit interconnections; Integrated circuit reliability; Metallization; Reliability engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN
0-7803-7649-8
Type
conf
DOI
10.1109/RELPHY.2003.1197822
Filename
1197822
Link To Document