Eutectic Bonding of Integrated Circuits Onto Polycarbonate and Poly(Methyl Methacrylate) by Means of Indium–Tin and Indium–Bismuth

Eutectic compounds play an important role in the fabrication and packaging of devices with low thermal budgets. Taking low-cost polymers into account, eutectic soldering and eutectic bonding temperatures below the glass transition temperature of the aforementioned polymers, 150 °C and below, need to be met. In this regard, thermocompressive eutectic bonding processes of silicon integrated circuits by means of the binary eutectic compounds indium-tin and indium-bismuth were optimized with regard to least necessary thermal energy, and the feasibility thereof onto polycarbonate and poly(methyl methacrylate) substrates was investigated.