• DocumentCode
    39550
  • Title

    Variability Mitigation Mechanisms in Scaled 3T1D-DRAM Memories to 22 nm and Beyond

  • Author

    Amat, Esteve ; Almudever, C.G. ; Aymerich, N. ; Canal, Ramon ; Rubio, Albert

  • Author_Institution
    Univ. Politec. de Catalunya, Barcelona, Spain
  • Volume
    13
  • Issue
    1
  • fYear
    2013
  • fDate
    Mar-13
  • Firstpage
    103
  • Lastpage
    109
  • Abstract
    It has been stated that 3T1D-DRAM cell is a valid alternative to be implemented on L1 memory cache to substitute 6T, highly affected by variability. In this paper, it is shown that the 3T1D memory cells present significant tolerance to high levels of device parameter fluctuation when they are scaled to nodes smaller than 22 nm. Furthermore, we present some strategies to mitigate the cell variability. Moreover, while scaling down capacitorless DRAM cells is a challenging trend, we also show how the scaling drawbacks can be compensated through the following: 1) the channel strain of the cell devices and 2) the proposal of new strategies to further enhance the memory cell behavior.
  • Keywords
    DRAM chips; L1 memory cache; cell device channel strain; device parameter fluctuation; scaled 3T1D-DRAM memory; scaling down capacitorless DRAM cell; size 22 nm; variability mitigation mechanism; Computer architecture; Fluctuations; Logic gates; Microprocessors; Performance evaluation; Random access memory; Strain; DRAM; temperature; variability;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2012.2217497
  • Filename
    6296696