DocumentCode
396985
Title
The role of laminate, LTCC, and silicon based approaches to system in package development
Author
Law, E. ; Kossives, D.P. ; Bailey, K. ; Sahakian, D. ; Ling, J. ; Emigh, R.
Author_Institution
ST Assembly & Test Services Inc., Tempe, AZ, USA
fYear
2003
fDate
16-18 July 2003
Firstpage
249
Lastpage
254
Abstract
As the wireless industry continues to advance, demand for further system miniaturization, cost reduction, improved performance, and reliability are increasing. Several new substrate technology solutions have shown the potential to successfully integrate the passive components. Each of these solutions has advantages, disadvantages, and limitations. A Power Amplifier (PA) case study was conducted to compare the benefits and drawbacks between the laminate, ceramic and high resistivity silicon substrates.
Keywords
ceramic packaging; ceramics; cost reduction; elemental semiconductors; laminates; reliability; silicon; LTCC; Si; cost reduction; laminate; package development system; passive components; power amplifier; silicon substrates; substrate technology; system miniaturization; wireless industry; Ceramics; Conductivity; Costs; Dielectric constant; Dielectric losses; Dielectric substrates; Laminates; Packaging; Routing; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
ISSN
1089-8190
Print_ISBN
0-7803-7933-0
Type
conf
DOI
10.1109/IEMT.2003.1225909
Filename
1225909
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