DocumentCode
397250
Title
System level power-performance trade-offs in embedded systems using voltage and frequency scaling of off-chip buses and memory
Author
Puttaswamy, Kiran ; Choi, Kyu-Won ; Park, Jun Cheol ; Mooney, V.J. ; Chatterjee, Abhijit ; Ellervee, Peeter
Author_Institution
Center for Res. in Embedded Syst. & Technol., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2002
fDate
2-4 Oct. 2002
Firstpage
225
Lastpage
230
Abstract
In embedded systems, off-chip buses and memory (i.e., L2 memory as opposed to the L1 memory which is usually on-chip cache) consume significant power often more than the processor itself. In this paper for the case of an embedded system with one processor chip and one memory chip, we propose frequency and voltage scaling of the off-chip buses and the memory chip and use a known micro-architectural enhancement called a store buffer to reduce the resulting impact on execution time. Our benchmarks show a system (processor + off-chip bus + off-chip memory) power savings of 28% to 36%, an energy savings of 13% to 35%, all while increasing the execution time in the range of 1% to 29%. Previous work in power-aware computing has focused on frequency and voltage scaling of the processors or selective power-down of sub-sets of off-chip memory chips. This paper quantitatively explores voltage/frequency scaling of off-chip buses and memory as a means of trading off performance for power/energy at the system level in embedded systems.
Keywords
embedded systems; memory architecture; power consumption; embedded systems; frequency scaling; memory chip; microarchitectural enhancement; off-chip buses; off-chip memory; power-aware computing; processor chip; store buffer; system level power-performance trade-offs; voltage scaling; Batteries; Buffer storage; Design optimization; Dynamic voltage scaling; Embedded computing; Embedded system; Energy dissipation; Frequency; Permission; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
System Synthesis, 2002. 15th International Symposium on
Conference_Location
Kyoto, Japan
Print_ISBN
1-58113-576-9
Type
conf
Filename
1227182
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