DocumentCode
399784
Title
Reliability behavior of RF MEMS
Author
Melle, S. ; Flourens, F. ; Dubuc, D. ; Grenier, K. ; Pons, P. ; Pressecq, F. ; Kuchenbecker, J. ; Muraro, J.L. ; Bary, L. ; Plana, R.
Author_Institution
Lab. d´´Autom. et d´´Anal. des Syst., CNRS, Toulouse, France
Volume
1
fYear
2003
fDate
28 Sept.-2 Oct. 2003
Abstract
This paper outlines the reliability properties of RF MEMS devices and circuits. The tools used to evaluate the reliability properties are presented. Results are shown on both moveable and non moveable devices. Key parameters that drive the reliability are pointed out: stress, roughness, temperature dependance, dielectric properties. Finally, it is presented some solutions to improve the reliability performance of these devices in term of technology and design.
Keywords
contact resistance; micromechanical devices; semiconductor device reliability; surface roughness; MEMS circuits; MEMS devices; RF MEMS; dielectric properties; moveable devices; nonmoveable devices; reliability properties; roughness; stress; temperature dependance; Circuits; Dielectrics; Filters; Insertion loss; Micromechanical devices; Packaging; Radiofrequency microelectromechanical systems; Space technology; Stress; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 2003. CAS 2003. International
Print_ISBN
0-7803-7821-0
Type
conf
DOI
10.1109/SMICND.2003.1251337
Filename
1251337
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