• DocumentCode
    400905
  • Title

    Cleaning procedure for indium implantation

  • Author

    Yamashita, Takayoshi ; Miyamoto, Naoyuki ; Miyabayashi, K. ; Nagayama, Tsutomu

  • fYear
    2002
  • fDate
    27-27 Sept. 2002
  • Firstpage
    455
  • Lastpage
    458
  • Abstract
    Indium implantation in a medium current ion implantation becomes a common requirement for the next generation VLSI fabrication. It is essential to keep high utilization rate of equipment to reduce the cost of VLSI fabrication. As for a medium current ion implanter, running all ion species including indium ion in one machine is the solution to keep high utilization rate of the machine. To use the indium ion with other ion species in a medium current ion implanter, it is necessary to control the cross contamination of the indium when implantation other ion species. In this paper, experimental data of the indium cross contamination at B, P, As implantation is reviewed and effective cleaning procedure to reduce cross contamination and other side effects of indium usage is reported.
  • Keywords
    arsenic; boron; contamination; indium; ion implantation; phosphorus; semiconductor doping; surface cleaning; As; B; In; In implantation; P; cleaning procedure; cross contamination; medium current ion implanter; next generation VLSI fabrication; utilization rate; Cleaning; Contamination; Fabrication; Indium; Ion implantation; Ion sources; Magnetic analysis; Plasma temperature; Pollution measurement; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
  • Conference_Location
    Taos, New Mexico, USA
  • Print_ISBN
    0-7803-7155-0
  • Type

    conf

  • DOI
    10.1109/IIT.2002.1258039
  • Filename
    1258039