DocumentCode
400905
Title
Cleaning procedure for indium implantation
Author
Yamashita, Takayoshi ; Miyamoto, Naoyuki ; Miyabayashi, K. ; Nagayama, Tsutomu
fYear
2002
fDate
27-27 Sept. 2002
Firstpage
455
Lastpage
458
Abstract
Indium implantation in a medium current ion implantation becomes a common requirement for the next generation VLSI fabrication. It is essential to keep high utilization rate of equipment to reduce the cost of VLSI fabrication. As for a medium current ion implanter, running all ion species including indium ion in one machine is the solution to keep high utilization rate of the machine. To use the indium ion with other ion species in a medium current ion implanter, it is necessary to control the cross contamination of the indium when implantation other ion species. In this paper, experimental data of the indium cross contamination at B, P, As implantation is reviewed and effective cleaning procedure to reduce cross contamination and other side effects of indium usage is reported.
Keywords
arsenic; boron; contamination; indium; ion implantation; phosphorus; semiconductor doping; surface cleaning; As; B; In; In implantation; P; cleaning procedure; cross contamination; medium current ion implanter; next generation VLSI fabrication; utilization rate; Cleaning; Contamination; Fabrication; Indium; Ion implantation; Ion sources; Magnetic analysis; Plasma temperature; Pollution measurement; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location
Taos, New Mexico, USA
Print_ISBN
0-7803-7155-0
Type
conf
DOI
10.1109/IIT.2002.1258039
Filename
1258039
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