• DocumentCode
    400951
  • Title

    Gas cluster ion beam processing equipment

  • Author

    Bachand, J. ; Freytsis, A. ; Harrington, E. ; Gwinn, M. ; Hofmeester, N. ; Hautala, J. ; Regan, K.

  • fYear
    2002
  • fDate
    27-27 Sept. 2002
  • Firstpage
    669
  • Lastpage
    672
  • Abstract
    Gas cluster ion beams (GCIB) are finding many applications for surface smoothing and etching of a variety of materials including semiconductors. Epion has developed commercial processing equipment, which makes possible practical application of GCIB beams for production processes. This equipment includes automatic recipe setup and tracking. Process uniformity and repeatability has been demonstrated to be better than 1%. Charge control keeps substrate charging to less than ±6 V. Throughputs as high as 10 W/hr are achievable with 200 mm wafers.
  • Keywords
    beam handling equipment; focused ion beam technology; ion beam assisted deposition; ion beams; ionised cluster beam deposition; sputter etching; surface cleaning; 200 mm; 6 V; charge control; etching; gas cluster ion beam processing equipment; process uniformity; repeatability; surface smoothing; Atomic measurements; Electrons; Etching; Gases; III-V semiconductor materials; Ion beams; Nitrogen; Smoothing methods; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
  • Conference_Location
    Taos, New Mexico, USA
  • Print_ISBN
    0-7803-7155-0
  • Type

    conf

  • DOI
    10.1109/IIT.2002.1258094
  • Filename
    1258094