Miniature Ka-band I/Q vector modulator using 3D-MMIC technology

Author

Ng, C.Y. ; Chongcheawchamnan, M. ; Robertson, I.D.

Author_Institution

Sch. of Electron. & Phys. Sci., Surrey Univ., Guildford, UK

Volume

2

fYear

2003

fDate

7-9 Oct. 2003

Firstpage

841

Abstract

A 3D-MMIC I/Q vector modulator for direct multilevel modulation at 38GHz is reported. The experimental 3D-MMIC process developed at Bookham Technology (Caswell) offers 5 metal layers with BCB dielectric, making it possible to miniaturise the passive components using the lumped-distributed technique, overlaid couplers and TFMS lines. This approach offers compactness and easy implementation as compared to the planar forms. The modulator measures only 1.9 × 0.9 mm² and achieves exceptionally precise tuning response leading to a near-ideal square constellation plot, making the modulator suitable for advanced signal processing and modulation techniques.

Keywords

MMIC; modulators; 38 GHz; 3D-MMIC process; 3D-MMIC technology; BCB dielectric; Bookham Technology; Caswell; TFMS lines; advanced signal processing; direct multilevel modulation; lumped-distributed technique; miniature Ka-band I-Q vector modulator; overlaid couplers; square constellation plot; Attenuators; Costs; Couplers; Dielectric substrates; Gallium arsenide; MMICs; Microwave devices; Microwave technology; Radar signal processing; Transmitters;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2003. 33rd European

Print_ISBN

1-58053-834-7

Type

conf

DOI

10.1109/EUMC.2003.1263021

Filename

1263021